Integrated Circuit Packaging, Assembly and Interconnections - William Greig - Books - Springer-Verlag New York Inc. - 9780387281537 - March 30, 2007
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William Greig
Integrated Circuit Packaging, Assembly and Interconnections 2007 edition

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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.

300 pages, 75 black & white illustrations, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released March 30, 2007
ISBN13 9780387281537
Publishers Springer-Verlag New York Inc.
Pages 300
Dimensions 155 × 235 × 19 mm   ·   662 g
Language English  

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