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Recent Trends in VLSI and Semiconductor Packaging
Recent Trends in VLSI and Semiconductor Packaging
The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | May 6, 2025 |
| ISBN13 | 9781041017875 |
| Publishers | Taylor & Francis Ltd |
| Pages | 616 |
| Dimensions | 150 × 220 × 10 mm · 1.56 kg |
| Language | English |
| Editor | Rao, K. Madhava |
| Editor | Reddy, T. Vasudeva |