Polymeric Materials for Electronic Packaging - Nakamura, Shozo (Nakamura Technical Research Institute) - Books - John Wiley & Sons Inc - 9781394188796 - September 20, 2023
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Polymeric Materials for Electronic Packaging

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250 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released September 20, 2023
ISBN13 9781394188796
Publishers John Wiley & Sons Inc
Pages 208
Dimensions 150 × 220 × 20 mm   ·   444 g

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