Designing Tsvs for 3D Integrated Circuits - Springerbriefs in Electrical and Computer Engineering - Nauman Khan - Books - Springer-Verlag New York Inc. - 9781461455073 - September 23, 2012
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Designing Tsvs for 3D Integrated Circuits - Springerbriefs in Electrical and Computer Engineering

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84 pages, 5 black & white illustrations, 29 colour illustrations, 16 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 23, 2012
ISBN13 9781461455073
Publishers Springer-Verlag New York Inc.
Pages 84
Dimensions 155 × 235 × 10 mm   ·   181 g
Language English  

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