On-chip Thermal Monitoring: Design, Placement and Interconnection of Temperature Sensors - Marisa Lopez-vallejo - Books - LAP LAMBERT Academic Publishing - 9783659511264 - January 3, 2014
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On-chip Thermal Monitoring: Design, Placement and Interconnection of Temperature Sensors

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Temperature is a first class design concern in modern integrated circuits. The important increase in power densities associated to recent technology evolutions has lead to the apparition of thermal gradients and hot spots during run time operation. Temperature impacts several circuit parameters such as speed, cooling budgets, reliability, power consumption, etc. In order to fight against these negative effects, dynamic thermal management techniques adapt the behavior of the chip relying on the information of a monitoring system that provides run-time thermal information of the die surface. This book covers the most important topics related to on-chip thermal monitoring, such as the design, placement and interconnection of temperature sensors, from a practical perspective.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released January 3, 2014
ISBN13 9783659511264
Publishers LAP LAMBERT Academic Publishing
Pages 188
Dimensions 150 × 220 × 10 mm   ·   298 g
Language German